Thick Film
Alumina Technologies provides customization services catered to:- Hybrid ceramic substrate
- Ceramic substrate for optical communication
- Any high power, small size, high development of life
- Request for high temperature, high humidity and other harsh environment… etc.
- Thin Profile
- Universal High Thermal Conduction
- Stability
- Capability for flip chip and eutectic bonding
- High power durability
- Similar thermal-expansion coefficient to Chip