Alumina Technologies, Inc

Thick Film

Thick Film

Alumina Technologies provides customization services catered to:
  • Hybrid ceramic substrate
  • Ceramic substrate for optical communication
  • Any high power, small size, high development of life
  • Request for high temperature, high humidity and other harsh environment… etc.
  Competitive Advantages:
  • Thin Profile
  • Universal High Thermal Conduction
  • Stability
  • Capability for flip chip and eutectic bonding
  • High power durability
  • Similar thermal-expansion coefficient to Chip
  Alumina Technologies provides custom design service for ceramic metallized substrates. Please see production process for thick-film substrate below: