Thin Film

  • Alumina Technologies, Inc
  • Thin Film

    • Thin Film

    Alumina Technologies provides customization services catered to:
    • Hybrid ceramic substrate
    • Ceramic substrate for optical communication
    • Any high power, small size, high development of life
    • Request for high temperature, high humidity and other harsh environment… etc.
    Competitive Advantages:
    • Thin Profile
    • Universal High Thermal Conduction
    • Stability
    • Capability for flip chip and eutectic bonding
    • High power durability
    • Similar thermal-expansion coefficient to Chip
    Alumina Technologies provides custom design service for ceramic metallized substrates. We possess two different processes of production for thin-film substrate:

    Ceramic Substrate DCM (Direct Coating Metal) Process flow Ceramic Substrate DBC (Direct Bond Copper) Process flow

    Alumina Technologies, Inc