Alumina Technologies, Inc

Thin Film

Thin Film

Alumina Technologies provides customization services catered to:
  • Hybrid ceramic substrate
  • Ceramic substrate for optical communication
  • Any high power, small size, high development of life
  • Request for high temperature, high humidity and other harsh environment… etc.
Competitive Advantages:
  • Thin Profile
  • Universal High Thermal Conduction
  • Stability
  • Capability for flip chip and eutectic bonding
  • High power durability
  • Similar thermal-expansion coefficient to Chip
Alumina Technologies provides custom design service for ceramic metallized substrates. We possess two different processes of production for thin-film substrate:

Ceramic Substrate DCM (Direct Coating Metal) Process flow Ceramic Substrate DBC (Direct Bond Copper) Process flow